Job - Technical Expert/Program Manager/Director for Computing/AI Chipset and System R&D

Back to Jobs

Technical Expert/Program Manager/Director for Computing/AI Chipset and System R&D

The vacancy has expired

Location

Belgium

Job Description

Client Background

Our client is a leading European R&D center focused on advanced computing architectures and AI system innovations. With a mission to drive cutting-edge development in AI accelerators, semiconductor integration, and high-performance systems, the organization plays a critical role in shaping the future of intelligent computing platforms across industries.

Responsibilities

As a 3DIC STCO R&D Leader, you will play a central role in leading and coordinating strategic research and development programs in the rapidly evolving domain of 3D integration and system-technology co-optimization.

Your responsibilities include:

Perform in-depth literature and trend analysis, simulations, and feasibility assessments to evaluate emerging 3DIC and STCO technologies.

Produce high-level technical analysis reports to inform senior leadership and help shape long-term R&D strategies.

Define and lead cross-functional innovation initiatives aligned with corporate and business unit goals.

Build and manage a network of international academic and industrial collaborators to foster external innovation.

Provide guidance on product development strategies across design, packaging, and architecture teams.

Support and guide early validation efforts, including prototyping and experimental proof-of-concept studies.

Organize internal technical seminars and engage in continuous exchanges with ecosystem stakeholders.

Requirements

PhD in Electrical Engineering, Microelectronics, or a related field, with 5+ years of experience in academia or industry.

3DIC architecture and system design

Physical design and layout of 3DICs

Advanced 3D packaging (e.g., wafer-to-wafer, die-to-wafer)

STCO for interconnects, power delivery, or thermal management

Integration of heterogeneous technologies (e.g., computing, AI, mobile SoCs)

Signal and power integrity in advanced multi-die systems

Strong analytical and systems-thinking abilities

Self-motivated and forward-thinking in tracking emerging technologies

Excellent communication and strategic presentation skills

Experience in leading complex, cross-functional research projects

Strong collaboration mindset, with ability to drive alignment across diverse teams

Fluent in English (spoken and written)

Proficient in PowerPoint and Excel for reporting and presentations