Perform in-depth literature and trend analysis, simulations, and feasibility assessments to evaluate emerging 3DIC and STCO technologies. 

Produce high-level technical analysis reports to inform senior leadership and help shape long-term R&D strategies. 

Define and lead cross-functional innovation initiatives aligned with corporate and business unit goals. 

Build and manage a network of international academic and industrial collaborators to foster external innovation. 

Provide guidance on product development strategies across design, packaging, and architecture teams. 

Support and guide early validation efforts, including prototyping and experimental proof-of-concept studies. 

Organize internal technical seminars and engage in continuous exchanges with ecosystem stakeholders. 

PhD in Electrical Engineering, Microelectronics, or a related field, with 5+ years of experience in academia or industry. 

3DIC architecture and system design 

Physical design and layout of 3DICs 

Advanced 3D packaging (e.g., wafer-to-wafer, die-to-wafer) 

STCO for interconnects, power delivery, or thermal management 

Integration of heterogeneous technologies (e.g., computing, AI, mobile SoCs) 

Signal and power integrity in advanced multi-die systems 

Strong analytical and systems-thinking abilities 

Self-motivated and forward-thinking in tracking emerging technologies 

Excellent communication and strategic presentation skills 

Experience in leading complex, cross-functional research projects 

Strong collaboration mindset, with ability to drive alignment across diverse teams 

Fluent in English (spoken and written) 

Proficient in PowerPoint and Excel for reporting and presentations